A team led by the University of Texas at Austin and partnered with Rice University was awarded $840 million to develop “the next generation of high-performing semiconductor microsystems" for the U.S. Department of Defense.

The Defense Advanced Research Projects Agency (DARPA) selected UT’s Texas Institute for Electronics (TIE) semiconductor consortium to establish a national open access R&D and prototyping fabrication facility.

The facility hopes to enable the DOD to create higher performance, lower power, lightweight, and compact defense systems. The technology could apply to radar, satellite imaging, unmanned aerial vehicles, or other systems, and ultimately will assist with national security and global military leadership. As a member of DARPA’s Next Generation Microelectronics Manufacturing (NGMM) team, Rice’s contributions are key.

Executive vice president for research Ramamoorthy Ramesh and the Rice researchers will focus on technologies for improving computing efficiency. In a Rice press release, Ramesh notes the need to enhance “energy-efficient computing” which highlights Rice’s qualifications to contribute to the solution.

New microsystem designs will be enabled by 3D heterogeneous integration (3DHI)semi, which is a semiconductor fabrication technology that integrates diverse materials and components into microsystems via precision assembly technologies.

Kepler Computing, is a member of the NGMM team and utilizes ferroelectrics to develop energy-efficient approaches in computer memory and logic, and was co-founded by Ramesh. Other Rice researchers include:

• Lane Martin, director of the Rice Advanced Materials Institute
• Ashok Veeraraghavan, chair of electrical and computer engineering
• Pulickel Ajayan, the Benjamin M. and Mary Greenwood Anderson Professor of Engineering and founding chair of the materials science and nanoengineering department
• Kaiyuan Yang, associate professor of electrical and computer engineering
• Guha Balakrishnan, assistant professor of electrical and computer engineering

“Given the rapid growth of machine learning AI applications, there is a pressing need to fundamentally rethink current computing methodologies to advance the next generation of microelectronics,” Ramesh says in a news release. ”Rice University boasts world-class researchers with exceptional expertise in computer and electrical engineering poised to bolster this critical federally funded initiative.”

Overall, the project represents a total investment of $1.4 billion. The $840 million award from DARPA is a return on the Texas Legislature’s $552 million investment in TIE. TIE has funded the update of two UT fabrication facilities.

“TIE is tapping into the semiconductor talent available in Texas and nationally to build an outstanding team of semiconductor technologists and executives that can create this national center of excellence in 3DHI microsystems,” S.V. Sreenivasan, TIE founder and chief technology officer and UT professor of mechanical engineering adds.

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This article originally ran on EnergyCapital.